buy2fix
EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write Socket
EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write Socket
In Stock.
Couldn't load pickup availability
Shipping Guarantee
Shipping Guarantee
FREE SHIPPING on all UK orders. Fully Insured.
Handling time 1 - 3 working days. (Buy2fix has to process your order and put all your items through its strict quality-control tests.)
Transit time 5 - 10 working days.
Return Guarantee
Return Guarantee
For whatever reason if you are unsatisfied with your order within 7 days you can return it to us in new condition for a refund minus the shipping charges.
DOA Guarantee
DOA Guarantee
If your item arrives damaged, please contact us within 7 days and provide clear and valid proof. Buy2fix will make compensation based on the damage situation.
Missing/Wrong Items Guarantee
Missing/Wrong Items Guarantee
If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. Buy2fix will make compensation based on the damage situation.
1. Type: test block
2. Working frequency: high frequency
3. Application: integrated circuit IC
4. Interface type: terminal
5. Production process: injection molding
6. Features: stable testing
7. Contact material: beryllium copper shrapnel
8. Insulator material: PET
9. Number of cores: 17
10. Purpose: programming socket, test socket, for testing, reading and writing of EMCP IC chips
11. Lead spacing: 0.5mm
12. Service life: 100,000 times
Testing method:
1. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction
2. Plug the USB cable into the USB port of the computer, turn on the power switch of the socket, and select the corresponding test program
Features:
1. Also compatible with 186-FBGA 162-FBGA
2. The shrapnel is made of imported beryllium copper by high-precision die stamping, and the head-shaped probe is designed to be hardened and thickened in the later stage to ensure product stability and durability.
3. Support hot plugging and separate power switch, support for testing through the USB interface or through the connection with the board on the board corresponding to the PIN
4. Using floating board structure, precise positioning, convenient IC picking and placement, higher work efficiency
5. The test board is welded to the adapter board, the test socket does not need to be soldered, and the pinholes are inserted into the adapter board
Share
